Samsung’s upcoming flagship device is quite frequent on the rumor mill and their leaks have been surfacing online for quite some time now. And now for the first time render images of the device have been surfaced.
The South Korea giant has already confirmed they the next flagship smartphone will debut at MWC 2018. The company has already started sending out the invites for the February 25 ‘unpack event’ which is scheduled to take place in Barcelona.
This new leak comes courtesy of the one and only Evan “evleaks” Blass, at VentureBeat, who has a reliable track record when it comes to smartphone leaks and rumors.
The above-depicted render image shows the design of Galaxy S9 (left) and S9+(right). The handsets are codenamed “Star” and “Star 2”, respectively. The normal variant will flaunt a 5.8″ screen size and the plus variant will have a 6.2″ screen.
In the United States and China, the handsets will be power a Qualcomm Snapdragon 845 chipset and the rest of the world will get the Exynos 9810 chipset variant.
The S9 will be coupled with 4GB of RAM and 64GB of onboard storage and the plus variant will come with 6GB RAM and 128GB storage option. There’s also a fingerprint scanner located on the rear side of both the variants and company have included stereo speakers located on the bottom side.
According to recent revealing, a major focus of the phones will be the cameras. Even the invite itself only says – “The Camera. Reimagined”.
It’s also come to hear that the handsets will detect motion and capture “super slow-mo” video in 480fps at 720p, and the primary 12MP cameras are said to have a variable aperture. And the reports have also suggested that there will be a mechanical adjustment that switches between f/2.4 and smallest-in-class f/1.5.
As per the report from the below source suggests, pre-order of the device will commence starting February 26 – the day after the event – with the units shipping to customers on March 16.